ARTICLE:

• FLAT MICRO HEAT PIPES FOR ELECTRONIC COOLING: AN ELABORATED MODEL OF THE HEAT TRANSFER  download article

S. Tzanova
Technical University of Sofia, Sofia, Bulgaria

G. Angelov
Technical University, Sofia, Bulgaria

L. Kamenova
Technical University, Sofia, Bulgaria

Ch. Schaeffer
Institut National Polytechnique, Grenoble, France

ABSTRACT

The vapour flow and heat transfer characteristics of flat micro heat pipes are analysed, proceeding from the model developed by A. Faghri. A new analytically derived expression for the friction factor-Reynolds number product is presented. The model is realized in Matlab; the ordinary differential equations are solved using the Runge-Kutta method. The simulated maximal dissipated power as a function of the heat input temperature given by the model is compared with other theoretical models and the experimental results of the Laboratoire d'Electrotechnique de Grenoble for copper and silicon prototypes.

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