ARTICLE:

• EFFECT OF HEAT SPREADING ON THE PERFORMANCE OF HEAT SINK VIA VAPOR CHAMBER  download article

Y. S. Chen
Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan, Republic of China

K. H. Chien
Energy & Environment Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310

T. C. Hung
Department of Mechanical and Automation Engineering, I-Shou University, Kaohsiung County, Taiwan, Republic of China

B. S Pei
Department of Engineering and System Science, National Tsing Hua University, Hsinchu, Taiwan, Republic of China

Chi-Chuan Wang
Energy and Resources Laboratories, Industrial Technology Research Institute, Taiwan, R.O.C.

ABSTRACT

This study investigates the thermal spreading capability of the vapor chamber subject to the change of heater size. The vapor chamber was assembled with a plate-fin heat sink and mounted in a wind tunnel. Additionally, a copper plate and another aluminum plate having the same size were also adapted for comparison. Experimental results indicate that the effective overall thermal resistance across the heat spreaders increases with respect to smaller heater size for the same heat input. For vapor chamber, the corresponding temperature difference between evaporator and condenser increases with the input power and it is considerably augmented when the heater size is reduced. For the same heater size, the thermal resistance of vapor chamber is about 15% less than the copper plate. In addition, the condenser of vapor chamber shows an excellent uniform distribution in temperature and this phenomenon is especially pronounced when its size is further reduced. Comparing with the metal plates, the vapor chamber provides a lower temperature rise and better spreading performance, which is helpful for the thermal management of the small chips.

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